BOUNDARYCOOL™
LEARN ABOUT OUR JOURNEY, VALUES, AND VISION
A motion partner building brand-led identities, systems, and applications.
BUILT FOR +1 kW-CLASS AI & HPC PROCESSORS
Lower Cold Plate Temperature vs. Microchannel Cold Plate ⓘ
Less Coolant Flow Rate for Same Cold Plate Temperature vs Microchannel Cold Plate ⓘ
BoundaryCool™ is a next-generation active cooling solution for high-power AI, HPC, and data-center processors. It integrates a proprietary active thermal-management system inside a direct-to-chip (D2C) cold plate to boost heat transfer without increasing coolant flow or pump power—enabling lower cold-plate temperatures, higher rack density, and lower facility energy use.
ⓘ Tested under matched TDP, coolant, and inlet temperature; flow rate adjusted to match cold plate ΔT.
Data Center
POWER ELECTRONICS
HVAC
Two Phase Cooling
A proprietary active mechanism inside the cold plate enhances fluid-surface interaction to dramatically increase heat transfer.
Lower cold-plate temperatures with minimal pressure drop and lower coolant flow—reducing pump power and cooling energy.
Intelligent monitoring + adaptive control that tunes cooling performance to workload demand across deployments.